SMT EMI gasket (PCB grounding pad)
Manufacturing is possible from a minimum of 0.5mm to a maximum of 25mm! A complete range of products by gasket size and material is available.
The "SMT EMI Gasket (PCB Ground Pad)" is a product designed to reduce electromagnetic noise generated from within electronic devices and protect circuits from electrical surges. The SMF01 series is manufactured using a method that wraps PU sponge with a conductive metal film. It is very soft, so it exerts almost no stress on the PCB. The SMF02 series is a small SMT EMI gasket composed of a silicone rubber core and a conductive metal surface layer, suitable for small IT devices such as mobile phones. 【Features】 ■ The SMF01 series is suitable for medium to small sizes, while the SMF0 series is suitable for ultra-small sizes. ■ A variety of materials can be selected to match the characteristics of the device. ■ Excellent electrical conductivity (resistance below 0.1Ω) and compression recovery rate (over 90%). ■ A combination of product materials and shapes ensures adhesion and minimizes stress on the PCB. *For more details, please refer to the PDF document or feel free to contact us.
- Company：利送イーエムシー
- Price：Other
